1.The core components of our products are all from the top international companies in the industry,and the products have excellent cost performance and consistent performance;
2.Macro channel water-cooled structure sealing,large water flow,heat dissipation ability,not high requirements for water quality,stable performance,are warmly welcomed by customers;
3.Adopting the advanced vacuum sintering technology of Au-Sn hard solders,and the unique air-tight sealing of alloy solders,inert gas protection,effectively avoiding smile effect,thermal fatigue,material performance degradation,and greatly improving product life and stability;
4.The fast axis and slow axis divergence Angle of the chip used in the product is leading in the industry,with unit energy concentration,low drift,stable wavelength and better spot quality;
5.The group has 15 years of experience in semiconductor research and development,sealing,mass production and sales to ensure the stability of products and the timeliness of later diversified product development,thus driving more cooperation among customers;
6.Our products in the industry take more than 50%market share,more powerful to ensure the consistency and stability of a large number of products,to provide customers with a longer life cycle of product security and service.
Simulated calculation and optical path simulation based on professional optical software; Design optimization of laser optical path conduction based on experimental verification; Obtain the best spot uniformity and the lowest light loss.
Optical design technology
Optimize the design of laser internal lead layout, flow channel structure, parts and components assembly logic, so that the overall structure of the laser, from the sealing, heat uniformity, liquidity to achieve the most enhanced effect.
Structure design technology
With professional thermodynamics analysis software and experiment data; Using the best heat transfer gradient material combination scheme for structure design in order to keep the thermal stability of the system; To prevent the occurrence of thermal tearing between different material under rapid changes in temperature; To avoid and slow down the short-term effect of heat accumulation and long-term thermal fatigue.
Material application and heat dissipation design technology
Industry leading technology of hard solder vacuum sintering helps precised chip welding. The thermal matching scheme designed by the integration of material-thermal-force-structure can effectively avoid chip damage due to thermal mismatch and effectively control the failure caused by thermal migration, electrical migration and thermal fatigue damage of materials.
Vacuum sintering technology
Thermal fatigue shock, electrical durability shock, life acceleration test and laser damage threshold test are adopted to eliminate early laser failure and ensure the consistency and service life of the laser stack.
Accelerated aging technology
Using the industry's advanced instruments, through the chip's electrical property, wave property, beam quality measurement, effectively control the quality of the laser stack. Accurately determine and analyze the failure modes of customer application scenarios, and implement efficient solutions.
Measurement and analysis technology
Material--Finished Products Quality Control Inspection Pictures