Vacuum sintering technology
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Industry leading technology of hard solder vacuum sintering helps precised chip welding. The thermal matching scheme designed by the integration of material-thermal-force-structure can effectively avoid chip damage due to thermal mismatch and effectively control the failure caused by thermal migration, electrical migration and thermal fatigue damage of materials.
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E-mail：Domestic sales：dsales@oephotonics.com
Overseas sales：fsales@oephotonics.com
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